TY  - BOOK
AU  - Niess, J.-Lerch, W.
TI  - Rapid Thermal Processing and Beyond: Applications in Semiconductor Processing
T2  - Materials Science Forum
SN  - 9783038131731
AV  - QC611.6.T4 R37 2008eb 
U1  - 621.38152 
PY  - 2008///
PB  - Trans Tech Publications Ltd
KW  - Rapid thermal processing.,Semiconductors--Thermal properties
KW  - TECHNOLOGY & ENGINEERING / Materials Science / General
UR  - https://search.ebscohost.com/login.aspx?direct=true&db=e230xww&scope=site&site=ehost-live&AN=512841
ER  -